Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

Taiwan Semiconductor Manufacturing (TSMC) said it plans to open an advanced chip packaging facility in Arizona by 2029, ...

Onto Innovation is becoming one of AI's most important behind-the-scenes winners by ensuring advanced chips work flawlessly ...

Can KLA's AI-driven packaging boom and rising chip complexity power advanced packaging revenues to $1B by 2026?

Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain ...

Taiwan Semiconductor Manufacturing Company (TSM) is up 40% in 2026 alone as investors price in a much larger chip market and ...

Leading contract chip manufacturer Taiwan Semiconductor Manufacturing(NYSE: TSM) estimates the semiconductor market will ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

ASML (ASML) shipped its first advanced packaging lithography system in late 2025 to expand beyond EUV. Taiwan Semiconductor holds over 50% of the high-end CoWoS advanced packaging market for AI chips.

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging ...

Taiwan Semiconductor Manufacturing Co (ADR) (NYSE:TSM), the world's largest contract chipmaker, now expects the global ...