Samsung vice president Kim Dae-woo said the South Korean giant made its new 16-layer HBM with HBM3 but plans to use HBM4 to improve productivity. Due to alignment issues, Samsung was expected to use ...

(MENAFN- PR Newswire) The EVG40 D2W can be used for any D2W bonding application, including chiplet integration, high-bandwidth memory (HBM) stacks, and 3D system on chip (SoC) integration processes, ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die ...