BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the ...

Ball grid array (BGA) reworking typically involves de-soldering and resoldering the chip to remove defective components and mount new ones. However, it’s a complex task, and people can easily make ...

SMD components may be a little challenging for the home builder – even though the’re inordinately practical for homebrew PCBs – but if you play around with electronics and solder long enough, you’re ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the ...

[Colin] uses some spare boards to lock the target board down to his bench and then uses a custom stencil and solder paste to prep the board. Once he has the solder paste on, he places the components ...