The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

When designing electronics, heat dissipated to the surroundings by micro devices is an important consideration because heat has a powerful and stringent effect on their operation and lifespan. When an ...

Vishay Intertechnology, Inc. introduced a new version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK® power ICs, and DrMOS products: ThermaSim 3.0. For precise ...

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...

eASIC and Computer Simulation Technology (CST) to demonstrate up to 5x reduction in co-simulation time for multi-level PCB package design Santa Clara, CA – October 29, 2013 – eASIC® Corporation, ...

Version 3.0 of Flomerics'(www.flomerics.com) Flo/PCB thermal simulation software helps solve thermal problems in solder reflow processing associated with the use of lead-free solders. In particular, ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...

Printed Circuit Boards (PCBs) are a fundamental part of the majority of electronics systems. They are primarily designed to mechanically support and electrically connect electronic components, and are ...

Pulsonix, the industry-leading PCB design software from WestDev Ltd, has announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal ...

Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, ...