Analog fabs are bolstering their electronic design automation (EDA) tool repository to complement design flows in advanced RF devices, and the latest example comes from Tower Semiconductor’s adoption ...
real-world validation. Innovative STCO strategies can drastically reduce GPU peak temperature. As HPC and AI accelerators push power densities to 1kW and beyond, the heat generated by rapidly ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
A broad association of researchers from across Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of California, Berkeley have collaborated to perform an unprecedented simulation ...
The semiconductor industry has witnessed rapid advancements in the pursuit of integrating more functionality into smaller footprints, pushing the boundaries of traditional two-dimensional integrated ...
Manage thermal challenges in compact, power-dense electronics using multiphysics simulation. Learn to predict heat transfer, ...
Validated by early deployments at leading semiconductor companies, Vinci’s physics-driven AI software operates up to 1000x faster than conventional simulation tools, at higher accuracy without needing ...
Surface-mount polymer positive temperature coefficient (PPTC) devices are widely used resettable protection components in modern electronic systems. These devices are commonly selected when designers ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results