Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...

The complexity of DRC rules increases with shrinking geometries. It is not that the laws of physics change with shrinking IC feature size; they are just more strictly enforced. At one time, there was ...

In the vast reaches of the semiconductor cosmos, a silent menace lurks—one that can obliterate years of design work in a fraction of a nanosecond. Electrostatic discharge (ESD) verification stands as ...

Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa One smart verification software portfolio to accelerate creation, verification planning, ...

Layout versus schematic (LVS) comparison is a crucial step in integrated circuit (IC) design verification, ensuring that the physical layout of the circuit matches its schematic representation. The ...

Solution integrates the Virtuoso platform with Allegro and Sigrity technologies to streamline overall design process and significantly improve productivity and cycle time SAN JOSE, Calif., May 30, ...

The urgency for change: Are traditional DRC debug flows enough? Physical verification engineers know all too well the reality of debugging massive integrated circuit (IC) designs. For years, the ...

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...

As long as there has beena semiconductor industry, each new generation of chips has been characterized by a drive for finer features. This drive has brought increased integration, enhanced ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...