Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The ...

image: Defect engineering is an effective strategy to modify 2D materials for enhanced HER activity. By structuring edge defects, vacancy defects and dopant derived defects, the electronic structure ...

The system, developed by Panevo, a Canadian clear technology and manufacturing analytics company, reportedly achieved approximately 97% detection reliability with minimal false positives of Muskoka’s ...

Semiconductor process engineers have always understood the need to inspect silicon wafers to identify defects and eliminate them at their source. To simplify the process, semiconductor equipment ...

Key opportunities in the surface vision and inspection market include rising demand for AI-driven 3D inspection, robotic ...

“Launching a new Surfscan platform is an exciting event for KLA-Tencor,” said Ali Salehpour, senior vice president and general manager of the Surfscan / ADE division at KLA-Tencor. “The visible-light ...

Premature finishing, overworking the surface and inadequate curing are typical causes of surface defects on exterior slabs. Some of these defects include premature wear, scaling, mortar flaking and ...