Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...

WILMINGTON, DE / ACCESSWIRE / April 18, 2023 / Transparency Market Research Inc. - The surge in adoption of antenna-in-package (AiP) technology by chipmakers can be ascribed to a rise in demand for ...

An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...

Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...

Samsung Electro-Mechanics will invest 300 billion won ($231 million) to expand production of semiconductor package substrates and widen its product range to produce substrates for servers. The ...

Korean companies will show the newest semiconductor packaging technology at an annual trade show on Wednesday, as techniques grow more important in improving the performance of high-end chips. Samsung ...

Fine pitch copper (Cu) pillar bump adoption has been growing in high-performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very ...

Bigger . . . faster . . . stronger. It's not only an adage pushing athletes in professional sports. These same attributes are driving electronic flip chip ball grid array (FCBGA) packages (see figure ...

SoC designs require the integration of digital signal processor cores, custom logic, memory and analog on a single chip. Consequently, these designs require signal integrity of critical nets, and ...