KAOHSIUNG, Sept. 1, 2024 /PRNewswire/ -- E&R Engineering Corp. (8027.TWO) hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination ...

KAOHSIUNG, Oct. 23, 2023 /PRNewswire/ -- On September 19, 2023, Intel announced one of the industry's first glass substrates for next-generation advanced packaging. The industry believes that glass ...

China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in yield and process ...

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass ...

SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- JNTC Co., Ltd. (KOSDAQ: 204270), a leading advanced materials company, hosted a product launch on June 30 at the Korea Exchange Conference Hall, ...

The drive for increased performance is enticing some advanced packaging manufacturers to transition from traditional organic substrates to glass core substrates, a switch that comes with numerous ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

As demand for artificial intelligence (AI) semiconductors continues to surge, the market for glass substrates, which are widely regarded as a critical material for next-generation... Rapidus, Japan's ...

As artificial intelligence (AI) becomes more widely used, an industry sector that is also heating up is glass substrates. Major domestic component companies are entering the commercialization of glass ...