As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical ...

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of ...

On May 29, 2025, Marvell Technology, Inc. (NASDAQ:MRVL) launched the latest addition to its IP portfolio of custom AI compute platforms, a multi-die packaging platform. This production-qualified ...

These recent customer wins represent a meaningful step forward in ACM’s continued expansion of its advanced packaging platform and global customer base, reflecting growing industry recognition of ...

SANTA CLARA, Calif., May 29, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, has expanded the packaging ecosystem for AI ...

FREUDENSTADT, Germany, April 30, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

Manz Asia will be demonstrating its advanced inkjet metallization using Smartkem's (SMTK) advanced dielectric materials at SEMICON® SEA 2025 in Singapore, May 20-22, 2025. Visit Manz Asia at Booth no.

What are the qualifications of the people conducting IDTechEx research? Content produced by IDTechEx is researched and written by our technical analysts, each with a PhD or master's degree in their ...

ASE Technology Holding Co. is experiencing renewed growth, driven by surging demand for advanced semiconductor packaging and TSMC outsourcing CoWoS orders. ASX stock has returned 52.4% over the past ...