Electronic designers need greater integration densities and faster data transfer rates to meet the increased performance requirements of technologies like 5G/6G, autonomous driving, and artificial ...

PITTSBURGH, July 23, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain ...

Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...

Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs) ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...

The addition of Diakopto's solutions to Ansys' portfolio will deliver a competitive edge to engineers using Ansys to create high-performance integrated circuits Diakopto's unique and market-leading ...

PITTSBURGH, June 19, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights ...

Ansys' certified semiconductor solutions will enable Faraday to shorten design cycles of 2.5D/3D-ICs and ensure designs meet signal integrity and performance goals Faraday Technology Corporation will ...