Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...

Ajinomoto has informed IC substrate makers that it will raise prices for its key ABF build-up film by 30%, with the new ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

Global Electronics Association has released IPC-6921, Requirements and Acceptance for Organic IC Substrates, a new international standard establishing clear qualification, performance, and acceptance ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

South Korea's leading IC design company, LX Semicon, is reportedly downsizing its Silicon Carbide (SiC) semiconductor R&D operations. Some subscribers prefer to save their log-in information so they ...