TL;DR: Samsung will begin mass production of next-gen 1c DRAM-based HBM4 memory, 24Gb GDDR7 dies, and 128GB+ DDR5 products in 2026, targeting AI and server markets. The company reported record Q3 2025 ...

TL;DR: SK hynix is preparing for mass production of its 16-Hi HBM3E memory, following its recent unveiling of the world's first 48GB version. The company is integrating new equipment and optimizing ...

With capacity shifting to high-margin HBM for AI data centers, traditional DRAM supply is collapsing, pushing enterprise IT ...

AP Memory has announced that its new generation PSRAM, known as ApSRAM (Attached-pSRAM), has completed customer platform validation and is slated for mass production by the end of 2025. The company ...

Samsung Electronics (OTCPK:SSNLF) has completed development of its sixth-generation High Bandwidth Memory (HBM4) chips and is entering the preparatory phase for mass production, AJU News reported. The ...

Sept. 12, 2024 — Memory technology company Samsung Electronics today announced it has begun mass production of its 1Tb quad-level cell (QLC) 9th-generation vertical NAND (V-NAND) flash memory. “With ...

SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that it has begun mass production of the industry’s first 1 Universal Flash Storage (UFS) 2 Ver. 4.0 embedded flash memory ...

Chinese memory maker CXMT has announced mass production of its LPDDR5X products at 8,533 Mbps and 9,600 Mbps, with the 10,667 Mbps version now in customer sampling. The lineup includes 12Gb and 16Gb ...

AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation discrete silicon capacitors are set to adopt embedded ...