Designed to provide low-current power cross protection of telecomm circuits, the SMP surface-mount fuse complies with Power Cross test requirements UL 1950/60950 and Belcore/Telcordia GR-1089 for ...
We report roll-to-roll fabrication of conductive copper circuits on flexible polyimide substrates, followed by integration of ultrathin, bare silicon chips and surface mount device components via flip ...
(Nanowerk News) Researchers have demonstrated a new hybrid method for manufacturing high-performance soft electronics that combines direct ink writing with automated pick-and-place of surface mount ...
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