Part 1 of this series described how digital signals propagate through PC boards [Refs. 1, 2, 5, 6]. In part 2, we look at specific board designs to achieve low EMI. The biggest issue I see in my ...
Like razors and hamburgers, the key to better OLED seems to be more stacks. Layers of OLED stacked on other layers of OLED can result in brighter and brighter displays. OLED screens on TVs, monitors, ...
Samsung has come out of the gate strong in 2024 by announcing it's developed a 12-layer version of the most cutting-edge high-bandwidth memory (HBM) available today, HBM3e. The development will move ...
Samsung Electronics is preparing for the introduction of its 9th Generation 3D-NAND, which employs a double-stack architecture projected for release in 2024. Based on information from DigiTimes that ...
Tom's Hardware on MSN
Samsung touts 96% lower-power NAND design — researchers investigate design based on ferroelectric transistors
Samsung researchers have published a detailed account of an experimental NAND architecture that aims to cut one of the ...
Part 1 of this series described how digital signals propagate through PC boards, and Part 2 described specific board stack-up designs to achieve low EMI. Part 3 will address partitioning of circuit ...
Micron Technology recently unveiled 176-layer, triple-level-cell (TLC), 3D NAND flash memory with a 30% smaller die size that employs a new replacement-gate (RG) NAND technology. The chips offer a 35% ...
Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Most organizations are now well into re-platforming their enterprise data ...
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