Applied Materials (NasdaqGS:AMAT) is acquiring ASMPT's NEXX business, adding advanced panel level packaging tools to its ...

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces. Apple is anticipated to bring out ...

This TechXchange examines chip packaging technology including new advances such as chiplets. Check out the video series on chip packaging. We’ve come a very long way from the first IC, but we still ...

Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain ...

Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...