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Samsung could bring a new thinner design to the Galaxy Z Fold 7 and Z Flip 7. There might also be a new affordable foldable, ...
Tom's Hardware on MSN1d
LG Innotek to slim down smartphones by replacing solder balls with copper postsLG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...
The Huawei Mate XT Ultimate sets a new benchmark for tri-fold phones, showing they're no longer just experimental - but a ...
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