ECUs that are designed today need to have the performance and flexibility to run the workloads of the next decade.

Winter sports equipment aerodynamics: If winter sports excite you, consider simulating the aerodynamics of a bobsled, ...

SDVs are booming, but designing hardware that can run software updates a decade in the future is a huge challenge.

At Rambus, we often receive RFIs, RFPs and RFQs for security silicon IP cores to be used in our customer’s next semiconductor ...

The international standard has been proven effective in automotive functional safety and has begun to spread to other markets ...

To tackle these reliability challenges, IC designers are increasingly embracing a “shift-left” mindset, where reliability ...

A technical paper titled “Roadmap for Schottky barrier transistors” was published by researchers at University of Surrey, ...

A new technical paper titled “Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data ...

A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging ...

Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...

An Analysis of Low-Power Microcontrollers for Biomedical Applications” was published by researchers at EPFL. Abstract ...

The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...