Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips ...

During the Year of the Dragon, the TAIEX rose 5,429.34 points, the highest ever, while the 30 percent increase in the year ...

AI-chipmaker Nvidia on Wednesday became the most valued company in the world. Jensen Huang-led computer manufacturing ...

NVIDIA founder and CEO Jensen Huang visited Taichung on January 16 ... In addition to packaging, SPIL also continues to support wafer testing, finished product testing, and burn-in testing.

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...

Nvidia (NASDAQ:NVDA) CEO Jensen Huang confirmed the company's advanced ... utilizes chip-on-a-wafer substrate, or CoWoS, advanced packaging. An analysis issued yesterday by Ming-Chi Kuo with ...

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...