All-solid-state battery configuration with the abstract model. Various surface coating strategies are investigated by the proposed multiphysics model in terms of electrochemical-mechanical coupled ...
Abstract: As the integrated chip packaging technology progresses from 2.5D to 3D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
Imagine this: You’re a writer working on a script or—better yet—you’ve just finished your latest draft. You’ve spent months crafting characters, structuring plot, and developing story. You put the ...
Anyone who has purchased a car over the past decade knows that there has been a huge increase in the amount of compute processing involved in today’s modern automotive industry. Advanced chips for ...
3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...
Leadership is about much more than issuing orders or delegating tasks. One of your most essential roles as a leader is to serve as a role model. Your team is constantly observing how you conduct ...
The FEATool Multiphysics finite element analysis (FEA) and computational fluid dynamics (CFD) multi-solver/simulation toolbox from Precise Simulation has been updated ...
The word demure, seemingly out of nowhere, exploded online this month and sparked a cultural conversation. The beauty influencer who started the viral trend, Jools Lebron, told "CBS Mornings" about ...
Interposer on Package on PCB assembly captured for comprehensive IC to system level simulation and analysis. Ansys (2024 R2 redefines the boundaries of product design by enabling customers to move ...
Ahead of the November presidential election, just 19% of Americans say democracy in the United States is a good example for other countries to follow, according to a Pew Research Center survey ...
The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...
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