Abstract: Pulsed eddy current (PEC) testing is a nondestructive testing (NDT) method, which is highly suitable for thickness measurement and sub-surface-defect detection. In this article, PEC testing ...
Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...
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